Contract processing: "Fine powder processing" by blasting.
Introducing a blast treatment that demonstrates powerful effectiveness in removing dross and smear after laser processing.
Fine powder processing by blasting refers to the precise processing of fine particles at a micron level, propelled at high speeds. It demonstrates powerful effects in roughening the substrate surface, engraving, and removing dross and smear after laser processing. The dry films used for blasting in industrial applications are applied to LCDs, organic EL displays, silicon wafers, and more. [Grinding Materials Used] - Alumina - Glass beads - Silicon carbide *For more details, please refer to the PDF document or feel free to contact us.
- Company：ニッチュー
- Price：Other
